equipment:electronics:reflow_oven

Solder Reflow Oven - T-962

Burn Hazard

Items may still be hot after reflowing is done. Also the underside can get very hot during the cooling phase.

  • Effective soldering area: 180 x 235 mm

Basic Guidelines

  • Place oven on heat-proof mat (e.g. soldering workbench)
  • Power on reflow oven.
  • Place PCB into oven on rack.
  • Enter profile selection with F4
  • Choose profile with F1/F2 keys and press S to select.
  • Press S to start the profile.

Manual Mode

  • Press F3 from the main menu to enter manual mode.
  • Here you can set a temperature with F1/F2 keys.
  • A timer can be set with F3/F4.
  • After preheating the timer will begin counting down.
  • Once expired the oven will begin to cool down.

This is a T-962 solder reflow oven, with a few modifications

  • the cardboard insulation has been removed and aluminium tape used in its place
  • a cold-junction temperature sensor has been added
  • the firmware has been flashed to this one
  • equipment/electronics/reflow_oven.txt
  • Last modified: 2024/11/19 21:42
  • by 127.0.0.1