Table of Contents
Solder Reflow Oven - T-962
Specification
Instructions
Solder Reflow Oven - T-962
Burn Hazard
Items may still be hot after reflowing is done. Also the underside can get very hot during the cooling phase.
Specification
Effective soldering area: 180 x 235 mm
Instructions
Basic Guidelines
Place oven on heat-proof mat (e.g. soldering workbench)
Power on reflow oven.
Place PCB into oven on rack.
Enter profile selection with F4
Choose profile with F1/F2 keys and press S to select.
Press S to start the profile.
Manual Mode
Press F3 from the main menu to enter manual mode.
Here you can set a temperature with F1/F2 keys.
A timer can be set with F3/F4.
After preheating the timer will begin counting down.
Once expired the oven will begin to cool down.
About / Useful links
This is a T-962 solder reflow oven, with a few modifications
the cardboard insulation has been removed and aluminium tape used in its place
a cold-junction temperature sensor has been added
the firmware has been flashed to
this one